Transition metal polysulfides and their potential applications

S. B. Artemkina, E. D. Grayfer, M. N. Kozlova, P. A. Poltarak, A. A. Poltarak, V. E. Fedorov

Результат исследования: Публикации в книгах, отчётах, сборниках, трудах конференцийстатья в сборнике материалов конференциинаучнаярецензирование

Аннотация

Low-dimensional transition metal polysulfides are an interesting family of compounds, which have in common the presence of disulfide groups S-S. This feature dictates their unusual chemistry and electrochemistry. We have optimized synthetic procedures and systematically studied sulfides of IV-VI groups, such as TiS3, ZrS3, VS4, NbS3, CrS3 etc. in their bulk and nanosized forms. The nanosized samples were prepared by liquid-phase exfoliation of the bulk counterparts. Our preliminary studies show the promise of such materials for a variety of applications, including transistors, Li-ion batteries, and photocatalysis.

Язык оригиналаанглийский
Название основной публикации2018 41st International Convention on Information and Communication Technology, Electronics and Microelectronics, MIPRO 2018 - Proceedings
ИздательInstitute of Electrical and Electronics Engineers Inc.
Страницы36-39
Число страниц4
ISBN (электронное издание)9789532330977
DOI
СостояниеОпубликовано - 28 июн 2018
Событие41st International Convention on Information and Communication Technology, Electronics and Microelectronics, MIPRO 2018 - Opatija, Хорватия
Продолжительность: 21 мая 201825 мая 2018

Конференция

Конференция41st International Convention on Information and Communication Technology, Electronics and Microelectronics, MIPRO 2018
СтранаХорватия
ГородOpatija
Период21.05.201825.05.2018

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    Artemkina, S. B., Grayfer, E. D., Kozlova, M. N., Poltarak, P. A., Poltarak, A. A., & Fedorov, V. E. (2018). Transition metal polysulfides and their potential applications. В 2018 41st International Convention on Information and Communication Technology, Electronics and Microelectronics, MIPRO 2018 - Proceedings (стр. 36-39). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.23919/MIPRO.2018.8400007