Технические дисциплины и материаловедение
Chemical analysis
60%
Chemical bonds
46%
Decomposition
22%
Gas mixtures
70%
Gases
17%
Nanocomposite films
50%
Nanocomposites
100%
Nitrogen
28%
Optical emission spectroscopy
52%
Oxygen
25%
Plasma enhanced chemical vapor deposition
44%
Plasmas
28%
Silicon
73%
Temperature
24%
Thermodynamics
26%
X-Ray Emission Spectrometry
40%
Физика и астрономия
chemical bonds
35%
decomposition
23%
energy
9%
gas mixtures
58%
nanocomposites
81%
nitrogen
22%
optical emission spectroscopy
35%
oxygen
18%
silicon films
99%
simulation
11%
spectroscopy
16%
temperature
18%
thermodynamics
21%
vapor phases
24%
x rays
14%
Химические соединения
Chemical Bond
30%
Chemical Element
71%
Dioxygen
15%
Energy Dispersive X-Ray Spectroscopy
29%
Gas
49%
Mixture
40%
Nanocomposite
61%
Nitrogen
18%
Optical Emission Spectroscopy
39%
Plasma
19%
Thermodynamic Simulation
48%