Аннотация
Silicon oxide and silicon nitride are the two key dielectrics used in modern silicon devices. The memory properties of SiOx- and SiNx-based memristors obtained by plasma-enhanced chemical vapor deposition, pyrolysis, and high-frequency reactive sputtering are reviewed. The nitrides obtained by high-frequency reactive sputtering have the best memory properties: a memory window of 102, a memristor endurance of up to 109 cycles at the same memory window, and a memristor retention of up to 105 s at the same memory window.
Язык оригинала | английский |
---|---|
Страницы (с-по) | 722-731 |
Число страниц | 10 |
Журнал | Nanobiotechnology reports |
Том | 16 |
Номер выпуска | 6 |
DOI | |
Состояние | Опубликовано - нояб. 2021 |
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