Cu/synthetic and impact-diamond composite heat-conducting substrates

E. N. Galashov, A. A. Yusuf, E. M. Mandrik

Результат исследования: Научные публикации в периодических изданияхстатья по материалам конференциирецензирование

3 Цитирования (Scopus)

Аннотация

Composite material with high thermal conductivity was obtained by the method of thermal sintering of diamonds (synthetic and impact) and copper powder and by further hot isostatic pressing. The content of diamond (the particle size is 20 - 250 μm) in the diamond copper composite was 30 - 45 weight percent. The coefficient of thermal conductivity of copper diamond composite materials based on synthetic diamonds was measured to be 700 - 750 Wm-1K-1. The coefficient of thermal conductivity of copper diamond composite materials based on impact diamonds was measured to be 850 - 900 Wm-1 K-1. The coefficient of thermal expansion (CTE) was measured to be 5.5 - 6.5 • 10-6/°C for synthetic diamonds and 6.1 - 6.5 •10-6/°C for impact diamonds. The obtained copper diamond composite materials are promising to be used as crystal holders for semiconductor crystals in THz and microwave devices.

Язык оригиналаанглийский
Номер статьи012043
ЖурналJournal of Physics: Conference Series
Том690
Номер выпуска1
DOI
СостояниеОпубликовано - 26 фев 2016
Событие17th Russian Youth Conference on Physics of Semiconductors and Nanostructures, Opto- and Nanoelectronics, RYCPS 2015 - St. Petersburg, Российская Федерация
Продолжительность: 23 ноя 201527 ноя 2015

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