Cu/Diamond composite heat-conducting shims

E. N. Galashov; A. A. Yusuf; E. M. Mandrik

doi:10.1088/1742-6596/643/1/012089

Cu/Diamond composite heat-conducting shims

E. N. Galashov, A. A. Yusuf, E. M. Mandrik

Результат исследования: Научные публикации в периодических изданиях › статья по материалам конференции › рецензирование

Аннотация

Composite material with high thermal conductivity was obtained by the method of thermal sintering of a diamond (50 - 75%) with a size of 20 to 250 μm in a matrix of copper.Coefficient of thermal conductivity of copper diamond composite materials was measured and is 450 - 650 W•m^-1•K^-1. The coefficient of thermal expansion CTE was measured and is 5.5 - 7.5 • 10^-6/°C. The obtained copper diamond composite materials are promising objects for use in THz and microwave devices.

Язык оригинала	английский
Номер статьи	012089
Журнал	Journal of Physics: Conference Series
Том	643
Номер выпуска	1
DOI	https://doi.org/10.1088/1742-6596/643/1/012089
Состояние	Опубликовано - 2 нояб. 2015
Событие	2nd International School and Conference Saint-Petersburg OPEN on Optoelectronics, Photonics, Engineering and Nanostructures, SPbOPEN 2015 - St. Petersburg, Российская Федерация Продолжительность: 6 апр. 2015 → 8 апр. 2015

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10.1088/1742-6596/643/1/012089

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title = "Cu/Diamond composite heat-conducting shims",

abstract = "Composite material with high thermal conductivity was obtained by the method of thermal sintering of a diamond (50 - 75%) with a size of 20 to 250 μm in a matrix of copper.Coefficient of thermal conductivity of copper diamond composite materials was measured and is 450 - 650 W•m-1•K-1. The coefficient of thermal expansion CTE was measured and is 5.5 - 7.5 • 10-6/°C. The obtained copper diamond composite materials are promising objects for use in THz and microwave devices.",

author = "Galashov, {E. N.} and Yusuf, {A. A.} and Mandrik, {E. M.}",

note = "Copyright: Copyright 2018 Elsevier B.V., All rights reserved.; 2nd International School and Conference Saint-Petersburg OPEN on Optoelectronics, Photonics, Engineering and Nanostructures, SPbOPEN 2015 ; Conference date: 06-04-2015 Through 08-04-2015",

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Cu/Diamond composite heat-conducting shims. / Galashov, E. N.; Yusuf, A. A.; Mandrik, E. M.

В: Journal of Physics: Conference Series, Том 643, № 1, 012089, 02.11.2015.

Результат исследования: Научные публикации в периодических изданиях › статья по материалам конференции › рецензирование

TY - JOUR

T1 - Cu/Diamond composite heat-conducting shims

AU - Galashov, E. N.

AU - Yusuf, A. A.

AU - Mandrik, E. M.

PY - 2015/11/2

Y1 - 2015/11/2

N2 - Composite material with high thermal conductivity was obtained by the method of thermal sintering of a diamond (50 - 75%) with a size of 20 to 250 μm in a matrix of copper.Coefficient of thermal conductivity of copper diamond composite materials was measured and is 450 - 650 W•m-1•K-1. The coefficient of thermal expansion CTE was measured and is 5.5 - 7.5 • 10-6/°C. The obtained copper diamond composite materials are promising objects for use in THz and microwave devices.

AB - Composite material with high thermal conductivity was obtained by the method of thermal sintering of a diamond (50 - 75%) with a size of 20 to 250 μm in a matrix of copper.Coefficient of thermal conductivity of copper diamond composite materials was measured and is 450 - 650 W•m-1•K-1. The coefficient of thermal expansion CTE was measured and is 5.5 - 7.5 • 10-6/°C. The obtained copper diamond composite materials are promising objects for use in THz and microwave devices.

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U2 - 10.1088/1742-6596/643/1/012089

DO - 10.1088/1742-6596/643/1/012089

M3 - Conference article

AN - SCOPUS:84952919302

VL - 643

JO - Journal of Physics: Conference Series

JF - Journal of Physics: Conference Series

SN - 1742-6588

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T2 - 2nd International School and Conference Saint-Petersburg OPEN on Optoelectronics, Photonics, Engineering and Nanostructures, SPbOPEN 2015

Y2 - 6 April 2015 through 8 April 2015

ER -

Cu/Diamond composite heat-conducting shims

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