Layer exchange during aluminum-induced crystallization of silicon suboxide thin films

A. O. Zamchiy, E. A. Baranov, I. E. Merkulova, I. V. Korolkov, V. I. Vdovin, A. K. Gutakovskii, V. A. Volodin

Research output: Contribution to journalArticlepeer-review

Abstract

Aluminum-induced crystallization of a-SiO1.8 in the layer exchange mode was carried out. Annealing of a “SiO2 substrate/Al/a-SiO2 membrane/a-SiO1.8” stacked structure at 550 °C led to the formation of a continuous polycrystalline Si (poly-Si) thin film on the substrate, which is characteristic of the layer exchange process. However, the upper layer formed in the process had structural features that were not previously observed for the pure and slightly oxidized amorphous silicon as a Si-containing thin-film precursor. The high oxygen content in the system led to the non-uniform transformation of a-SiO1.8 layer, namely, to the formation of Al oxide islands of submicron size nearby the interface with poly-Si thin film as a result of the complete oxidation of the Al layer, whereas the other part of the upper layer was still unchanged. In addition, the embedding of Al into the SiO2 substrate accompanied by its oxidation was observed.

Original languageEnglish
Article number129723
JournalMaterials Letters
Volume293
DOIs
Publication statusPublished - 15 Jun 2021

Keywords

  • Aluminum-induced crystallization
  • Aluminum-induced layer exchange
  • Phase transformation
  • Polycrystalline silicon
  • Silicon suboxide
  • Thin films

OECD FOS+WOS

  • 2.05 MATERIALS ENGINEERING
  • 1.03 PHYSICAL SCIENCES AND ASTRONOMY
  • 1.03.UK PHYSICS, CONDENSED MATTER
  • 2.03 MECHANICAL ENGINEERING
  • 2.03.IU ENGINEERING, MECHANICAL

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