Interfacial thermal fluid phenomena in shear - Driven thin liquid films

Oleg Kabov, Dmitry Zaitsev, Egor Tkachenko

Research output: Contribution to journalConference articlepeer-review

4 Citations (Scopus)

Abstract

The fast development in semiconductor technology is leading to ever higher chip power dissipation and heat fluxes. Recently a novel method of effective cooling, in which heat removal is due to intensive evaporation of a thin liquid film, moving in a flat micro/minichannel under the action of gas or vapor flow has been proposed by the authors. Experimental studies of the flow and destruction of a water film, shear-driven in the channel, under heating from a local heat source with size of 1x1 cm2 has been performed. The influence of liquid and gas flow rates and the channel height (0.17-2.0 mm) on heat transfer and critical heat flux have been investigated. With the help of high-speed imaging it was found that the maximum intensity of heat removal from the heater is achieved in the mode, when the film flow continuity is broken, and the heater is covered with small (of about 100 microns) dry spots with the lifetime of about 1/100 - 1/1000 s; at that the number of spots that exist simultaneously on one square centimeter of the surface can reach several hundreds. Experiments have resulted in the values of heat flux and heat transfer coefficient, which are a record for a thin liquid film (1200 W/cm2 and 300 000 W/m2K, respectively). The values of the critical heat flux are by an order higher than the corresponding values in falling water films. It was found that the use of shear-driven liquid film allows to reach values of CHF several times higher than CHF for flow boiling in the same channel and an order of magnitude higher that CHF for boiling in mini-/microchannels under uniform heating for the same fluid flow rates, but higher length of the heating surface. The CHF values reached are close to the CHF for full evaporation of liquid.

Original languageEnglish
Pages (from-to)1061-1067
Number of pages7
JournalInternational Heat Transfer Conference
Volume2018-August
DOIs
Publication statusPublished - 1 Jan 2018
Event16th International Heat Transfer Conference, IHTC 2018 - Beijing, China
Duration: 10 Aug 201815 Aug 2018

Keywords

  • Boiling and Evaporation
  • Cooling of microelectronics
  • Heat transfer enhancement
  • Two-phase flow

OECD FOS+WOS

  • 2.07 ENVIRONMENTAL ENGINEERING
  • 1.03 PHYSICAL SCIENCES AND ASTRONOMY
  • 1.04 CHEMICAL SCIENCES

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