Development of the modern microelectronic equipment requires the effective cooling solutions because it is necessary to remove high heat fluxes of up to 1 kW/cm2 and higher from the local hot spots of the processor. Thin and ultra-thin (less than 10 μm in thickness) liquid films, moving under the action of a forced gas flow in a mini-channel, are promising for the use in the temperature control systems of the modern semiconductor devices. Here we report results of systematic experimental studies of the flow and rupture of a water film, shear-driven in the channel, under intense heating from a local heat source with size of 1x1 cm2. To carry out high-speed visualization of the process, the FASTCAM SA1.1 CCD camera is used (with the speed of up to 100 000 frames per second). The camera is equipped with an optical system of high spatial resolution (2.5 μm per 1 pixel of the camera sensor). With the help of high-speed imaging, it was found that the maximum intensity of heat removal from the heater is achieved in the mode, when the film flow continuity is broken. The heater is covered with dry spots having typical size on the order of 10-100 μm and typical lifetime on the order of 0.1-1 ms. At that, the number of dry spots that exist simultaneously on 1 cm2 of the heater surface can reach several hundred. During 1 s up to 1 million dry spots appear and disappear at the area of the heater.
|Number of pages||6|
|Journal||Journal of Physics: Conference Series|
|Publication status||Published - 28 Nov 2018|
|Event||34th Siberian Thermophysical Seminar Dedicated to the 85th Anniversary of Academician A. K. Rebrov, STS 2018 - Novosibirsk, Russian Federation|
Duration: 27 Aug 2018 → 30 Aug 2018