Cu/synthetic and impact-diamond composite heat-conducting substrates

E. N. Galashov, A. A. Yusuf, E. M. Mandrik

Research output: Contribution to journalConference articlepeer-review

3 Citations (Scopus)

Abstract

Composite material with high thermal conductivity was obtained by the method of thermal sintering of diamonds (synthetic and impact) and copper powder and by further hot isostatic pressing. The content of diamond (the particle size is 20 - 250 μm) in the diamond copper composite was 30 - 45 weight percent. The coefficient of thermal conductivity of copper diamond composite materials based on synthetic diamonds was measured to be 700 - 750 Wm-1K-1. The coefficient of thermal conductivity of copper diamond composite materials based on impact diamonds was measured to be 850 - 900 Wm-1 K-1. The coefficient of thermal expansion (CTE) was measured to be 5.5 - 6.5 • 10-6/°C for synthetic diamonds and 6.1 - 6.5 •10-6/°C for impact diamonds. The obtained copper diamond composite materials are promising to be used as crystal holders for semiconductor crystals in THz and microwave devices.

Original languageEnglish
Article number012043
JournalJournal of Physics: Conference Series
Volume690
Issue number1
DOIs
Publication statusPublished - 26 Feb 2016
Event17th Russian Youth Conference on Physics of Semiconductors and Nanostructures, Opto- and Nanoelectronics, RYCPS 2015 - St. Petersburg, Russian Federation
Duration: 23 Nov 201527 Nov 2015

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