Cu/Diamond composite heat-conducting shims

E. N. Galashov, A. A. Yusuf, E. M. Mandrik

Research output: Contribution to journalConference articlepeer-review

Abstract

Composite material with high thermal conductivity was obtained by the method of thermal sintering of a diamond (50 - 75%) with a size of 20 to 250 μm in a matrix of copper.Coefficient of thermal conductivity of copper diamond composite materials was measured and is 450 - 650 W•m-1•K-1. The coefficient of thermal expansion CTE was measured and is 5.5 - 7.5 • 10-6/°C. The obtained copper diamond composite materials are promising objects for use in THz and microwave devices.

Original languageEnglish
Article number012089
JournalJournal of Physics: Conference Series
Volume643
Issue number1
DOIs
Publication statusPublished - 2 Nov 2015
Event2nd International School and Conference Saint-Petersburg OPEN on Optoelectronics, Photonics, Engineering and Nanostructures, SPbOPEN 2015 - St. Petersburg, Russian Federation
Duration: 6 Apr 20158 Apr 2015

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