Composite material with high thermal conductivity was obtained by the method of thermal sintering of a diamond (50 - 75%) with a size of 20 to 250 μm in a matrix of copper.Coefficient of thermal conductivity of copper diamond composite materials was measured and is 450 - 650 W•m-1•K-1. The coefficient of thermal expansion CTE was measured and is 5.5 - 7.5 • 10-6/°C. The obtained copper diamond composite materials are promising objects for use in THz and microwave devices.
|Journal||Journal of Physics: Conference Series|
|Publication status||Published - 2 Nov 2015|
|Event||2nd International School and Conference Saint-Petersburg OPEN on Optoelectronics, Photonics, Engineering and Nanostructures, SPbOPEN 2015 - St. Petersburg, Russian Federation|
Duration: 6 Apr 2015 → 8 Apr 2015