Chemical Compounds

1. Fluorine containing polymers 98%
2. Silicon 54%
3. Laser ablation 38%
4. Gold 36%
5. Lasers 36%
6. Chemical vapor deposition 33%
7. Coatings 32%
8. Wetting 30%
9. Tin 29%
10. Infrared lasers 29%
11. Contact angle 29%
12. Wire 29%
13. Ablation 26%
14. Vacuum 26%
15. Pulsed lasers 25%
16. Silicon wafers 25%
17. Oxides 23%
18. Laser pulses 21%
19. Time delay 21%
20. Evaporation 21%
21. Melting 20%
22. Water 19%
23. Single crystals 18%
24. Gases 17%
25. Air 16%
26. Microstructure 15%
27. Processing 13%
28. Cracks 12%
29. Deposition rates 12%
30. Refractory metals 12%
31. Chemical analysis 11%
32. Substrates 11%
33. Surface structure 9%
34. Experiments 9%
35. Boundary conditions 9%
36. Irradiation 9%
37. Film thickness 7%
38. Periodic structures 7%
39. Laser beam effects 6%
40. Laser heating 6%
41. Laser damage 6%
42. Crystal orientation 6%
43. Navier Stokes equations 5%
44. Silver alloys 5%
45. Gold alloys 5%
46. Steam 5%
47. Vapor pressure 5%
48. Deposits 5%

Engineering & Materials Science

1. Fluorine containing polymers 98%
2. Laser ablation 38%
3. Lasers 36%
4. Chemical vapor deposition 33%
5. Silicon 32%
6. Coatings 32%
7. Wetting 30%
8. Infrared lasers 29%
9. Contact angle 29%
10. Gold 29%
11. Wire 29%
12. Ablation 26%
13. Vacuum 26%
14. Pulsed lasers 25%
15. Silicon wafers 25%
16. Tin 23%
17. Laser pulses 21%
18. Time delay 21%
19. Evaporation 21%
20. Melting 20%
21. Single crystals 18%
22. Air 16%
23. Microstructure 15%
24. Oxides 15%
25. Water 14%
26. Processing 13%
27. Cracks 12%
28. Deposition rates 12%
29. Refractory metals 12%
30. Chemical analysis 11%
31. Gases 11%
32. Substrates 11%
33. Surface structure 9%
34. Experiments 9%
35. Boundary conditions 9%
36. Irradiation 9%
37. Film thickness 7%
38. Periodic structures 7%
39. Laser beam effects 6%
40. Laser heating 6%
41. Laser damage 6%
42. Crystal orientation 6%
43. Navier Stokes equations 5%
44. Silver alloys 5%
45. Gold alloys 5%
46. Vapor pressure 5%
47. Deposits 5%

Physics & Astronomy

Chemistry and Materials

1. fluoropolymers 100%
2. gold 44%
3. wire 27%
4. silicon 27%
5. silicon oxides 25%
6. silver 22%
7. composite materials 15%
8. oxides 15%
9. amorphous silicon 7%

Engineering

1. coatings 43%
2. pulsed laser deposition 27%
3. laser ablation 23%
4. evaporation 18%
5. Mie scattering 9%
6. irradiation 7%

General

1. wettability 34%
2. vapor deposition 28%
3. lasers 24%
4. infrared lasers 24%
5. ablation 23%
6. pulsed lasers 21%
7. time lag 20%
8. wafers 18%
9. microstructure 15%
10. expansion 15%
11. single crystals 14%
12. simulation 13%
13. pulses 10%
14. cracks 9%
15. wire cloth 7%
16. fluence 7%
17. slip 6%
18. film thickness 6%
19. grids 6%
20. boundary conditions 5%
21. silver alloys 5%
22. gold alloys 5%

Physics

1. optical properties 33%
2. optics 18%
3. nanoparticles 16%
4. gas pressure 8%
5. vacuum 5%

Aerospace Sciences

1. plumes 23%